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Product specification
11
Chip Resistor Surface Mount
Thick film technology
INTRODUCTION
16
D E F I N I T I O N S O F P U L S E S
S INGLE PULSE
The resistor is considered to be operating under
D E T E R M I N A T I O N O F P U L S E - L O A D
The graphs in Figs 12 and 13 may be used to
determine the maximum pulse-load for a resistor.
single pulse conditions if, during its life, it is loaded
? ? For
repetitive rectangular pulses:
must be lower than the value of P? max given
with a limited number (approximately 1,500) of
pulses over long time intervals (greater than one
hour).
R EPETITIVE PULSE
The resistor is operating under repetitive pulse
conditions if it is loaded by a continuous train of
pulses of similar power.
??
??
V? i 2
R
by the solid lines of Fig. 12 for the applicable
value of t i and duty cycle t p /t i .
V? i must be lower than the value of V? max given
in Fig. 13 for the applicable value of t i .
The dashed line in Fig. 12 shows the observed
maximum load for the Size 1206 chip resistors under
? ? For repetitive exponential pulses:
?? As for rectangular pulses, except that t i = 0.5 ? .
single-pulse loading.
? ? For
single rectangular pulses:
V? i 2
must be lower than the P? max given by the
More usually, the resistor must withstand a
continuous train of pulses of repetition time ‘t p ’
during which only a small resistance change is
acceptable. This resistance change ( ? R/R) is equal to
the change permissible under continuous load
conditions. The continuous pulse train and small
permissible resistance change reduces the maximum
handling capability.
??
??
R
dashed line of Fig. 12 for the applicable value of
t i .
V? i must be lower than the value of V? max given
in Fig. 13 for the applicable value of t i .
The continuous pulse train maximum handling
capacity of chip resistors has been determined
experimentally.
Measurements have shown that the handling capacity
varies with the resistive value applied.
However, maximum peak pulse voltages as indicated
in Fig. 13, should not be exceeded.
www.yageo.com
Mar 25, 2008 V.7
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